塑封QFN器件,plastic packaging QFN device
1)plastic packaging QFN device塑封QFN器件
英文短句/例句
1.The effects of combining thermal-humidity and vapor pressure on delamination of plastic packaging QFN component集成湿热及蒸汽压对塑封QFN器件的层裂影响
2.Analysis on the Relation between EMC Property and Packaging Defect浅析环氧塑封料性能与器件封装缺陷
3.The Design and Implementation of QFN Inspection Software Base on Machine Vision;基于机器视觉的QFN芯片检测软件的设计与实现
4.Influence of EMC Material Property Parameters on Thermal Stress of QFNEMC材料特性参数对QFN器件热应力的影响
5.Effects of Moisture on the Reliability of QFN Device in Hygro-Thermal Environment湿热环境下吸潮对QFN器件可靠性的影响研究
6.Study on Interface Delamination of QFN under Thermal Shock Loading Based on CZM Method基于CZM法QFN器件热冲击载荷下的界面脱层研究
7.Reliability sensitivity analysis of the QFN device based on Monte Carlo method基于蒙特卡罗法的QFN器件可靠性灵敏度分析
8.General specification for electronic components plastic packaging equipmentsGB/T13947-1992电子元器件塑料封装设备通用技术条件
9.Simulation of Mechanical Behavior of Plastic Electronic Package under Temperature and Humidity Environment;温湿度条件下塑封电子器件力学行为的模拟
10.Optimal design of plastic electronic packaging component based on BP neural network基于BP神经网络的模塑封电子器件优化设计
11.Influence of combining thermal-humidity and vapor pressure on the reliability for plastic packaging device集成湿热及蒸汽压力对塑封器件可靠性的影响
12.Finite element analysis on soldered joint reliability of QFN deviceQFN封装焊点可靠性的有限元分析
13.Resolve A Problem of Dissipate Heat for Led’s Display with QFN利用QFN封装解决LED显示屏散热问题
14.Study on the Accelerated Soak Testing during Reliability Evaluation of Semiconductor Plastic Package半导体塑封器件在可靠性试验中加速浸润方法的研究
15.Study on Optimal Design Method for Micro-electronic Packaging Device Based on Artificial Neural Network基于人工神经网络的微电子塑封器件的优化设计方法研究
16.Effect of deionized water and NaCl solution on property of electronic component storage去离子水和5%NaCl溶液浸泡对塑封电子器件的影响
17.A Study on Electrochemical Corrosion Induced by Delamination during Hydrothermal Aging in Plastic Encapsulated Power Device塑封功率器件在湿热老化试验中分层导致的电化学腐蚀的分析
18.The FEA Simulation of Moisture Diffusion in Electronic Packages;塑料电子封装件中湿扩散有限元分析
相关短句/例句
QFN deviceQFN器件
1.QFN devices were exposed in hygro-thermal environment for 17 h,50 h and 96 h,and moisture diffusion intoQFN devices was analyzed and simulated,to build a wet-stress calculation model.选用QFN器件作为研究对象,首先进行QFN器件在高温高湿环境下吸潮17 h、50 h、96 h试验;然后利用有限元软件分析和模拟潮湿在QFN器件中的扩散行为,并建立湿气预处理阶段应力计算模型;最后,通过试验与仿真相结合,分析潮湿对封装可靠性的影响。
3)PEM塑封器件
1.The Failure ofPEM Caused by the Mismatch of CTE;热膨胀系数不匹配导致的塑封器件失效
2.PEMs are reputed to offer significant cost,availability,size and weight advantages,but someone still focuses on reliability issues.但是还是有相当一部分人对于塑封器件的可靠性持怀疑态度。
3.Based on this, high accelerate stress test (HAST) were done to evaluate the reliability ofPEM devices, the proposal from Goddard center of NASA which screen the high reliabilityPEM devices were introduced.针对影响塑封器件可靠性的五种失效机理,即腐蚀失效、爆米花效应、低温/温冲失效、闩锁以及工艺缺陷等方面进行分析和讨论,并提出利用高温潮热和温度冲击试验对塑封器件的可靠性进行评估。
4)plastic encapsulated microcircuits (PEM)塑封器件
1.With the persistent improvements in quality and reliability, the application of plastic encapsulated microcircuits (PEM) became more widespread, even including the military field.随着塑封器件(PEMs)质量和可靠性的不断提高,塑封器件的应用领域进一步扩展,也逐步应用于军事领域。
5)Plastic Packaging Device塑封器件
1.Influence of combining thermal-humidity and vapor pressure on the reliability for plastic packaging device集成湿热及蒸汽压力对塑封器件可靠性的影响
6)Quad flat no-lead packageQFN封装
延伸阅读
[styrene-(2-vinylpyridine)copolymer]分子式：分子量：CAS号：性质：学名苯乙烯-2-乙烯吡啶共聚物。微黄色粉末或透明小颗粒晶体。无臭，无味。不溶于水，溶于酸、乙醇、丙酮、氯仿。有抗水、防潮性能，适用于多种药片的包衣等。
