器件封装,device packaging
1)device packaging器件封装
英文短句/例句
1.Analysis on the Relation between EMC Property and Packaging Defect浅析环氧塑封料性能与器件封装缺陷
2.Thermal Analysis of LED Packages based on Heat Pipe Heat Sink基于热管散热的LED器件封装热分析
3.Current Situation of High-Power LED Encapsulant大功率LED器件封装材料的研究现状
4.Research and Development of Planar Waveguide Circuit"s Packaging Software平面波导器件封装工艺软件的研究与开发
5.PACKAGING OF WAVEGUIDE DEVICES BASED ON BULK SILICON MEMS TECHNOLOGY基于体硅微机械工艺的光波导器件封装技术
6.Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;应用于聚合物微器件封装的超声波键合系统
7.Study on Low Temperature Glass Frit Bonding for MEMS DeviceMEMS器件封装的低温玻璃浆料键合工艺研究
parison of Cu and Au Ballbonding in Microelectronics Packaging微电子器件封装中铜与金球键合的比较(英文)
9.FEA Method of High-power Semiconductor Encapsulation大功率半导体器件封装结构的有限元分析
10.Mechanical property of UV curable adhesive bonding in packaging of fiber array waveguide device阵列波导器件封装用UV胶粘接力学性能分析
11.Effect of Hydrogen on the Reliability of Microelectronic Devices氢对金属封装密封元器件可靠性的影响
12.Device level vacuum packaging technologies of MEMS gyroscopesMEMS陀螺仪器件级真空封装技术
13.A technique of converting web documents into component based on wrapper一种基于封装器的Web文档构件化技术
14.Electron-induced Damage of CMOS with Shielded Packages屏蔽材料封装CMOS器件的电子辐照损伤
15.Reliability of SOP Component Solder Joint小尺寸封装(SOP)器件焊点可靠性研究
16.Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;基于倒装焊接的电子封装器件热性能的研究
17.Moisture Absorption Property of Material and Moisture&Thermal Affects on Package"s Reliability封装材料的吸湿特性及湿、热对封装器件可靠性的影响
18.General specification for electronic components plastic packaging equipmentsGB/T13947-1992电子元器件塑料封装设备通用技术条件
相关短句/例句
micro-device packaging微器件封装
3)small outline device小封装器件
4)Packaging brazing of electronic devices电子器件封装
5)High frequency packaging高频器件封装
6)Generic software wrapper(GSW)通用软件封装器
1.Generic software wrapper(GSW) system is realized in Linux kernel.基于Linux系统设计并实现的通用软件封装器旨在操作系统内核中嵌入一个安全框架,该框架通过对指定的任何软件进行封装,实时监控软件与操作系统之间的系统调用,并依据封装器对其进行处理可实现多种安全策略(如访问控制、入侵检测),从而保护主机资源。
延伸阅读
Assembly晶粒封装以树酯或陶瓷材料，将晶粒包在其中，以达到保护晶粒，隔绝环境污染的目的，而此一连串的加工过程，即称为晶粒封装（assembly）。封装的材料不同，其封装的作法亦不同，本公司几乎都是以树酯材料作晶粒的封装，制程包括：芯片切割→晶粒目检→晶粒上「架」（导线架，即lead frame）→焊线→模压封装→稳定烘烤（使树酯物性稳定）→切框、弯脚成型→脚沾锡→盖印→完成。以树酯为材料之ic，通常用于消费性产品，如计算机、计算器，而以陶瓷作封装材料之ic，属于高性赖度之组件，通常用于飞弹、火箭等较精密的产品上。
